导热材料描述贝格斯GF1100SF贝格斯GF 1100SF导热凝脂

导热材料描述贝格斯GF1100SF贝格斯GF 1100SF导热凝脂
1  导热材料描述（Description）：

      1100SF是一种硅胶热传导应用方案。这种材料是由两部分组成的，在室温下进行固化。该材料具有较低的模量性能，然后对柔软的弹性弹性体进行了**，在操作过程中减少了热循环应力，在低应力应用程序的组装过程中几乎消除了压力。

     这双组份被着色作为混合指示器（按体积1:1）。混合系统将在室温下固化。与固化的热垫材料不同，这种液体方法在组装位移时提供了无限的厚度变化，几乎没有或没有压力。间隙填充器1100SF，虽然有一些**的粘接特性，但不适合在需要机械结构键的热接口应用中使用。

Gap Filler 1100SF is the thermal solution for silicone-sensitive applications. The material is supplied as a two-part component curing at room or elevated temperatures. The material exhibits low modulus properties then cures to a soft, flexible elastomer, helping reduce thermal cycling stresses during operation and virtually eliminating stress during assembly of low-stress applications.

The two components are colored to assist as a mix indicator (1:1 by volume). The mixed system will cure at ambient temperature. Unlike cured thermal pad materials, the liquid approach offers infinite thickness variations with little or no stress during assembly displacement. Gap Filler 1100SF, although exhibiting some natural tack characteristics, is not intended for use in thermal interface applications requiring a mechanical structural bond.
2  特性和优势（Features and Benefits）：
?热导率Thermal Conductivity: 1.1 W/m-k
?没有气体溢出，yichuNo silicone outgassing or extraction
?**级舒适，设计用于脆弱和低应力场合Ultra-conforming, designed for fragile and low-stress applications
?环境和加速固化方案Ambient and accelerated cure schedules
?完全固化** solids – no cure by-products